Cave Creek, Arizona March 19, 2013. The High Density Packaging (HDP) User Group headquartered in the United States announces that Kyzen Corporation has become its newest member.
Kyzen has committed to developing new and innovative cleaning products that are the best available in the market. Kyzen focuses on the needs of high technology manufacturing operations with special focus on electronics assembly, advanced packaging and a broad range of metal finishing and optics producers throughout the world.
Mike Bixenman Chief Technology Officer for Kyzen said “our industry moves forward by users and suppliers working together to understand the science behind the challenges we face together. That knowledge enables better materials to be developed and better processes to be adopted to overcome those challenges. At Kyzen, we look forward to working with the like-minded members of the HDP User Group as we tackle the science together.”
Marshall Andrews Executive Director of HDP User Group said “We are pleased to announce that Kyzen, one of the industry leaders in cleaning technologies, has joined our consortium. They are a key contributor in our Electro-Chemical Migration (ECM) project.” Many of the printed circuit boards currently being assembled use today’s “No-Clean” flux systems. The current industry standard test protocols are based on the “Clean” flux systems and were originally developed to identify highly ionic contaminant levels (halides) after a cleaning process. These test protocols are not completely effective at identifying ECM exposures from “No-Clean” flux residues, and as a result, new failure modes have begun appearing in the field. HDP Users Group’s ECM project will identify gaps in the current testing that allow the no-clean corrosion failures to go undetected. The team plans to make recommendations for revision of the test standards that can identify these additional corrosion risks, as well as develop procedures to prevent ECM failures.