Latest Project Activity

July 02, 2019

VeCS Technology Evaluation

The High Density Packaging User Group is starting a project to evaluate Vertical Conductive Structures – VeCS.  VeCS is a relatively new patented technology by NextGIn Technology for creating a…

Member Meetings

October 9 @ 9:00 am - October 10 @ 6:00 pm

HDP October 9–10, 2019 Member Meeting

hosted by DELL

Most Recent News

August 27, 2019

HDP User Group Announces Gen3 Membership

Cave Creek, Arizona July 25, 2019. High Density Packaging (HDP) User Group is pleased to announce that Gen3 has become our newest member. “We are very […]