VeCS Technology Evaluation

The High Density Packaging User Group is starting a project to evaluate Vertical Conductive Structures – VeCS.  VeCS is a relatively new patented technology by NextGIn Technology for creating a higher density of connections to the internal layers and with less distortion of the signal. The technology allows for less cutting of the ground/power planes for a better current carrying capacity and better reference plane for the striplines. The project will evaluate the reliability and signal integrity aspects of this technology as it pertains to our members technology interest.

Both VeCS 1 - For through board applications and VeCS 2- For blind structures will be evaluated.

 

Project stage: 
Project type: 
Lead company: 
WUS

If you are interested in participating in this project:

Members - Go to the "Subscribe Here" section to the right and select the "Subscribe to space" key.

Non Members - Go to the "Contact" section to the right and select the "Contact project facilitator" key.

Idea Information

Background: 

Background:

VeCS stands for “Vertical Conductive Structure”

  • A traditional through hole or blind hole is too big and too disturbing in terms of SI.
    • VCS creates a higher density of connections to the internal layers and with less distortion of the signal.
    • Less cutting in the power & ground planes for a better current carrying capacity and better reference plane for the striplines.
  • VeCS is patent pending and can be licensed via NextGIn technologies.
  • The technology can be built by any medium to advanced board shop after training and licensing. No direct new capital equipment is required.
  • Electronics market is in need for a technology solution, Microvias do not deliver enough for fine pitch high I/O count devices.

VeCS-1

 

VeCS – 2 High Aspect Ratio Blind Structures

  • Separate circuits on top and bottom – increase density and
  • Utilize routing space much better, no via penetration through the board. (no sequential lamination required).
  • Create connections for power(s) and ground for power hungry applications.
  • Stubless connection to internal layers.

VeCS Configurations

 

Problem: 

Problem:

  • Through hole technology is limited and takes to much space. Holes cannot be placed closer.
  • Sequential build-ups are a good but expensive solution. Yield is dropping when complexity increases.
  • Trend towards 0.8mm for Data/Tele-com and computing
    • Routing channel is becoming too small to rout (differential) 0,1mm track and gap.
    • Power distribution into core of package is difficult and expensive. Many heavy copper planes required.
  • PCB Technology is not keeping up with package trends
    • PCB’s prices will rise due
    • layer count increase,
    • Sequential builds
    • to yield loss and
    • Push for package complexity

Definition Information

Public