Ultra-Thin HDI Multi-Purpose Test Vehicle

As the electronics market is driven more and more by smartphones and notebooks, the rigid boards become smaller and thinner which only amplifies the lag between the current process methods/test vehicles and the design capabilities. This gap presently is as much as a decade behind.  As the gap grows, the older test vehicles become obsolete and are no longer applicable.  Each new product requires a unique test vehicle and modified process methods.  This engineering effort drives delays in production and manifests itself in increase costs for both OEM and suppliers.
The process methods used along with the current test vehicles used, do not capture interconnect density or thinness, they miss potential failure mechanisms (e.g., ion migration). In addition, the low density patterns introduce artifacts not seen in production before (e.g., distortion of via stack).  The test parameters may exceed practical limits of design or are inappropriate to application (e.g., 50V CAF).

As a result there is an increasing abandonment by the OEMs in favor of non-standardized “end product” test vehicles.  This only widens the gap between up-stream development & down-stream practice.  The only resolution is that the problem must be solved by the component, PCB & material supply-chain companies, because the OEMs are working in a black box.

 

Project stage: 
Lead company: 
TTM Technologies

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Idea Information

Background: 
 

 

Worldwide Shipments by Segment (Thousands)

 

 

 

2012

2013

2014

2017

 

 

PC (DT & NB)

341,263

315,229

302,315

271,612

 

 

Ultra Book

9,822

23,592

38,687

96,350

 

 

Tablet

116,113

197,202

265,731

467,951

 

 

Mobile Phone

1,746,176

1,875,774

1,949,722

2,128,871

 

 

Total

2,213,373

2,411,796

2,556,455

2,964,783

 

 

 

 

 

 

 

 

•The “Post PC Era” is upon us

•PC sales peaked Q1 2011, declined 4.9% YoY Q4-2011/Q4-2012
•Tablets outsold notebooks in USA, China in 2012
•Rapid adoption of consumer cloud computing
•OEMs/ODMs shifting R+D focus from desktop to mobile/wearables
Source: Gartner, May 2013
 
 

 

 
 
 

 

Problem: 
The design envelope for handheld/wearable electronic packaging is dominated by batteries & displays.  The PCBA design is miniaturized & modularized, and has a high flex content.  An extensive use of SoC design, with SiP, PoP & WCSP packaging coupled with low profile CSP, WCSP & microQFN devices, 0.40~0.30mm pitch on a ultra-thin 10-14 Layer HDI PCBs require things like:
•Via in Pad/stacked via ICT with increasing via/pad ratios
•Conductor line/space design rules approaching 40/60
•2 track routing in 0.40umm pitch devices
•25~40um dielectrics
•250~500um overall thickness
•Increasing use of hybrid, coreless & flex constructions
 

Definition Information

Goals / Benefits: 

 

Design, build, test & standardize an open-source rigid High Density
Interconnect test vehicle for qualification of components, Printed Circuit Boards & Printed Circuit Board Assemblies.
 
Benefits:
1- Less expensive qualifications
2- Quicker introduction of new materials/components
3- Common method across the industry
 
High level objectives: 

 

  1. Scale the TV to the smartphone form factors.
  2. Modularized the TV for various mixes of bare board & assembly testing using the following criteria:
  • 0.40, 0.35 & 0.30mm pitch BGA devices
  • 40/60um nominal line/space design rules
  • All Layer Via interconnect with stacked/staggered vias
  • 10 layer build-up options for HF FR4 & coreless materials with 25~40um thick dielectrics (e.g., 1027, 1037, PI film, RCC)
  • SMT or fine pitch test connectors
  • 2x3 or 3x4 set arrays
  • Standardized pallets/fixtures for assembly & test
Approach: 

This project will design the industry standard acceptiable coupons to fit on a TV representing the Printed Circuit Boards used in Handhelds, Wareables and tablets.

The project will build the nessesary parts to verify the designes to insure the data effectivness.

The final design will then be built in quanity and tested to all levels of product using the industry standard test methods to insure the quality and reliablity of the designs.

Key Participants: 
Boeing
Curtiss-Wright
Engent
Flex
Fujitsu
Hitachi Chemical
Huawei
Integral Technology
Isola Group
ITEQ
Kyzen
Nihon Superior
Nokia
NVIDIA
Oracle
Panasonic
Park Electrochemical
Rogers Corporation
Senju Comtek
Shengyi
TTM Technologies
UL
Public