Conduct electromigration tests as a function of low current density of 5 x 103 A/cm2, time and temperature. Cross-section of failed samples at higher current density prepared by FIB and SEM.
Complete the failure analysis, complete project report, and prepare journal publications.
Do additional experimental testing to quantify the thermomigration and stressmigration effects. If these effects are deemed to be significant, consider whether the project can be extended for another 6 months to run 3D FEM modeling quantifying the individual effects of electromigration, thermomigration and stressmigration.
Click on this link to download: Thermo-electromigration in WL-CSP Pb-free solder joints Phase II Proposal 2009.