RF Failure Detection
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- One of the benefits we obtained from the TSV projects is our understanding of the RF measurement technique that was pioneered at NIST
- We propose to use this technique to start a new project
- Instead of using TSVs for this work, we will use existing PCB designs and familiar components to generate a solder joint reliability study
- We will compare DC measurements to RF measurements
- Possibly we could use event detection in addition to or alternative to DC measurements
Many transmission lines on a high speed server or network board have signal budgets of 10dB or less. A 1 or 2 dB loss on a solder joint could result in signal integrity failures.
This is comparable to the loss typical in a well designed FCBGA package
DC and event detectors find opens.
Perhaps this is too late! RF may be able to detect incipient failures earlier.
- Use ATC to compare RF measurement to DC measurement failure distributions in solder joint reliability testing
- Determine if RF measurement is a useful method for determining a signal loss criterion for failure
- Possibly also compare RF measurement to event detection