Tin Whiskers Update Webinar at 10AM Central Time
Date: Thursday, Oct 29, 2015
Latest Findings in Tin Whiskers in Electronics Webinar
Thursday, October 29 at 10AM US Central Time (Webex)
Sponsored by the High Density Packaging Users Group www.hdpug.org
The purpose of this Webinar is to share recent developments regarding tin whiskers, particularly with respect to the use of SAC solders. Topics to be covered include whisker growth mechanisms, real life failure histories, and whisker mitigation strategies.
Top people in the field will give presentations and participate in a short Q&A session at the end of the webinar.