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Tuesday, May 2

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    10:49am
    [Public] admin updated Tin Whiskers Webinar 2015 May 2, 2017 - 10:49am

    [Public] admin updated Tin Whiskers Webinar 2015

    May 2, 2017 - 10:49am
    admin updated Tin Whiskers Webinar 2015

     

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    Dr. Michael Osterman (Ph.D., University of Maryland, 1991) heads the development of simulation assisted reliability assessment software for CALCE and simulation approaches for estimating time to failure of electronic hardware under test and field conditions. Dr. Osterman served as a subject matter expert on phase I and II of the Lead-free Manhattan Project sponsored by Office of Naval Research in conjunction with the Joint Defense Manufacturing Technical Panel (JDMTP). He has consulted with automotive, medical, defense, and industrial electronic companies on the transition to lead-free materials. He organized and chaired the International Symposium on Tin Whiskers from 2007 to 2015. He has written eight book chapters and over 120 articles. He is a senior member of IEEE and a member of AS
     
    Dr. Michael Osterman (Ph.D., University of Maryland, 1991) heads the development of simulation assisted reliability assessment software for CALCE and simulation approaches for estimating time to failure of electronic hardware under test and field conditions. Dr. Osterman served as a subject matter expert on phase I and II of the Lead-free Manhattan Project sponsored by Office of Naval Research in conjunction with the Joint Defense Manufacturing Technical Panel (JDMTP). He has consulted with automotive, medical, defense, and industrial electronic companies on the transition to lead-free materials. He organized and chaired the International Symposium on Tin Whiskers from 2007 to 2015. He has written eight book chapters and over 120 articles. He is a senior member of IEEE and a member of AS
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    [1] http://hdpug.org/content/latest-findings-tin-whiskers-electronics-webinar#Dave
     
    [1] http://hdpug.org/...
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    10:48am
    [Mini Power Cycles] admin created Tin Whiskers Webinar 2015 May 2, 2017 - 10:48am

    [Mini Power Cycles] admin created Tin Whiskers Webinar 2015

    May 2, 2017 - 10:48am
    admin created Tin Whiskers Webinar 2015

     

    In September of 2015, David Love (HDP User Group) had a conversation with Dr. Polina Snugovsky (Celestica). Polina had just wrapped up her work on the “Manhattan Project” - an Air Force sponsored long term study of the use of lead-free electronics in Aerospace and Military avionics.  In this study they uncovered new tin whisker failure modes related to SAC alloy solder joints. Although aware of the problems with certain flux types, he was quite startled at some of the other things reported.

     

    In this discussion, David and Polina decided to make the industry aware of these issues. The result was a Webinar, sponsored by the HDP User Group with the assistance of EIPC, IPC, SMTA, and SEMI, which was held on October 29, 2015. Over 190 people attended. The top people in tin whiskers research were on the panel. Topics covered were whisker growth mechanisms, real-life failure histories, and whisker mitigation strategies.

     

    HDP User Group is making this webinar freely available for you to download and watch. The original slides shown by the panelists are provided as free downloads as well. Please pass this along to your colleagues. It is important that the entire industry is aware of these findings.

     

     

    Agenda:

     

    ·         Brief introduction and welcome - D. Love (HDP User Group)

     

    ...

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    10:43am
    [Public] admin created Press Fit Paper Published at APEX 2017 May 2, 2017 - 10:43am Abstract More and more people and things are using electronic devices to communicate. Subsequently, many electronic products, in particular mobile base stations and core network nodes, need to handle enormous amounts of data per second. One important link in this communication chain is high speed press fit connectors that are often used to connect mother boards and back planes in core network nodes. These new high speed press fit connectors have several hundreds of thin, short and weak pins that are prone to damage. Small variations in via hole dimensions or hole plating thickness affect the connections; if the holes are too small, the pins may be bent or permanently deformed and if the holes are too large they will not form gas tight connections. An example of deformed high speed connector press fit pins inserted in plated holes of different sizes is given in Figure 1. Figure 1 – 3D CT x-ray image of deformed high speed press fit connection pins1. The goal of this project was to understand how rework of these new high speed press fit connectors affects connection strengths, hole wall deformations and plating cracks. admin created Press Fit Paper Published at APEX 2017

    [Public] admin created Press Fit Paper Published at APEX 2017

    May 2, 2017 - 10:43am
    admin created Press Fit Paper Published at APEX 2017

     

    Abstract

    More and more people and things are using electronic devices to communicate. Subsequently, many electronic products, in particular mobile base stations and core network nodes, need to handle enormous amounts of data per second. One important link in this communication chain is high speed press fit connectors that are often used to connect mother boards and back planes in core network nodes.

    These new high speed press fit connectors have several hundreds of thin, short and weak pins that are prone to damage. Small variations in via hole dimensions or hole plating thickness affect the connections; if the holes are too small, the pins may be bent or permanently deformed and if the holes are too large they will not form gas tight connections.

    An example of deformed high speed connector press fit pins inserted in plated holes of different sizes is given in Figure 1.

    ...

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    10:36am
    [Public] admin updated High Fequency Measurements Paper Published at APEX 2015 May 2, 2017 - 10:36am

    [Public] admin updated High Fequency Measurements Paper Published at APEX 2015

    May 2, 2017 - 10:36am
    admin updated High Fequency Measurements Paper Published at APEX 2015

     

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    High Fequency Measurements Paper Publish at APEX 2015
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    High Fequency Measurements Paper Published at APEX 2015
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    High Fequency Measurements Paper Publish at APEX 2015
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    High Fequency Measurements Paper Published at APEX 2015
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    10:35am
    [Public] admin created High Fequency Measurements Paper Published at APEX 2015 May 2, 2017 - 10:35am Abstract The High Density Packaging (HDP) user group has completed a project to evaluate the majority of viable Dk (Dielectric Constant)/Df (Dissipation Factor) electrical test methods, with a focus on the methods used for speeds above 2.0 GHz. A comparison of test methods at common through to higher frequency ranges was desired, testing a variety of laminate materials (standard volume production with UL approval, low loss, and "halogen-free" laminate materials). Variations in the test board material resin content/construction and copper foil surface roughness/type were minimized.  Problems with Dk and Df test methods and discrepancies in results are identified, as well as possible correlations or relationships among higher speed Dk & Df test methods.  An example of present difficulties with the variety of test methods used for the same laminate material: a) Cavity resonator method at 10 GHz: Df = 0.008 b) SPP Df test data at 6 GHz:   Df = 0.006 to 0.0075 c) IPC TM 2.5.5.5, 2-20 GHz Stripline, Panasonic Method    (3 layer stripline TV, 2x1078 dielectrics ~65% RC, 0.15 mm core): E-Glass Foil Type P using E-glass: Df = 0.003 to 0.006 Foil Type P using NE-Glass:  Df = 0.002 to 0.005 Foil Type R using E-Glass:  Df = 0.004 to 0.007 Foil Type R using NE-Glass:  Df = 0.003 to 0.006 d) IPC TM-650, 2.5.5.9, Laminator published data sheet [1 GHz, 54% RC]: Df = 0.002 The above shows a range of Df from 0.002 to 0.008 depending upon the test method and frequency used.  Dk measurement methods have similar disparities. admin created High Fequency Measurements Paper Published at APEX 2015

    [Public] admin created High Fequency Measurements Paper Published at APEX 2015

    May 2, 2017 - 10:35am
    admin created High Fequency Measurements Paper Published at APEX 2015

     

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Tuesday, April 25

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    10:49am
    [Public] admin created Ultra-Thin HDI Multi-Purpose Test Vehicle Paper SMTAi September 2016 April 25, 2017 - 10:49am ABSTRACT In the last decade, the Ultra-Thin HDI (High Density Interconnect) technology has dominated the mobile/wearable products designs, yet the standard test vehicles used for qualifying materials, components and connectors provided by IPC (Institute of Printed Circuits), ANSI (American National Standard Institute) and JEDEC (Joint Electron Device Engineering Council aka Solid State Technology Association), are obsolete and OEM’s (Original Equipment Manufacturer) have stopped using them. These test vehicles do not reflect the form factors, density and interconnect methods used by the industry. In addition, they do not capture failure modes of the fine pitch BGA (Ball Grid Array) technology and as a result don’t provide upstream Users adequate data for development. Microvias and dielectrics are the key, along with finer lines and spaces, in obtaining the density of Ultra-Thin HDI boards. Continuous reduction in PCB dimensions and feature sizes challenges both fabrication process and test vehicles. HDP User Group’s paper gives a brief introduction to the modern Ultra-Thin PCB (Printed Circuit Board) fabrication process.  It discusses typical board level reliability tests and presents a generic reliability test vehicle design which is based on current Ultra-Thin HDI technology. With the proposed test vehicles’ design of modularity and scalability it is easy to modify to meet the next generation of Ultra-Thin HDI PCB requirements. The study indicates that the proposed TV design covers HDI test requirements and most of the current tests are critical when evaluating modern Ultra-Thin HDI circuit board reliability. The HDP User Group project also conducted a study on the application and reliability of a very fine pitch WLCSP (Wafer Level Chip Scale Package) on this Ultra-Thin HDI test vehicle. A 0.3mm pitch WLCSP daisy chain, commercially available solder paste, flux and underfill were used for this study. The details of the assembly process including solder paste printing, dip flux, component placement, reflow and underfill dispensing are discussed. The impact of the test vehicle OSP (Organic Surface Protection) surface finish on the assembly process and result is addressed as well. JEDEC standard air-to-air thermal cycling and drop tests are performed for reliability evaluation purposes. The reliability data of solder paste printing vs. dip flux, underfill vs. non-underfill are compared and evaluated. All results show that the WLCSP application process and materials on the ultra-thin test vehicle are robust and reliable. admin created Ultra-Thin HDI Multi-Purpose Test Vehicle Paper SMTAi September 2016

    [Public] admin created Ultra-Thin HDI Multi-Purpose Test Vehicle Paper SMTAi September 2016

    April 25, 2017 - 10:49am
    admin created Ultra-Thin HDI Multi-Purpose Test Vehicle Paper SMTAi September 2016

     

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    10:35am
    [Public] admin created Smooth Copper Signal Integrity Paper Published at IPC APEX 2017 April 25, 2017 - 10:35am Abstract High Density Packaging (HDP) User Group has completed a project evaluating the high frequency loss impacts of a variety of imaged core surface treatments (bond enhancement treatments, including chemical bonding and newer low etch alternative oxides) applied just prior to press lamination. Initial high frequency Dk/Df electrical test results did not show a strong correlation with any of the methods utilized within this project to measured surface roughness. The more significant factor affecting the measured loss is the choice of pre-lamination surface treatment. Most of the new chemical treatment systems outperform the older existing systems which depend upon surface roughness techniques to promote adhesion. admin created Smooth Copper Signal Integrity Paper Published at IPC APEX 2017

    [Public] admin created Smooth Copper Signal Integrity Paper Published at IPC APEX 2017

    April 25, 2017 - 10:35am
    admin created Smooth Copper Signal Integrity Paper Published at IPC APEX 2017

     

    This is the paper written and published at APEX 2017 by Jim Fuller (Sanmina) and Karl Sauter (Oracle).

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Thursday, March 30

Wednesday, March 29

  • Your profile picture
    8:53am
    [Public] admin created BFR/PVC Cables & Wires HDP-iNEMI Whitepaper March 29, 2017 - 8:53am Halogens, and more specifically Bromine (Br) used as a flame retardant (BFRs) and Chlorine (Cl) used as a flame retardant and Polyvinyl Chloride (PVC), have been alleged to have a negative toxicological impact on human health and the environment in some studies. As a precautionary principle, many electronic manufacturers have publicly adopted initiatives to phase out the use of BFRs and PVC to potentially minimize the impact on the environment. The transition towards halogen free in electronics is dependent on commodity types. Certain commodities have drop-in replacement substances while others are challenged with performance, cost and availability. One type of commodity the industry continues to struggle with is PVC replacement on flexible cables and wires. Due to performance and safety requirements, the cable industry is challenged to find a robust and cost effective PVC replacement. To better understand if PVC alternatives are holistically more environmentally preferable than traditional PVC, a Life Cycle Assessment (LCA) is needed to assess other environmentally impactful attributes. As a result, to address industry wide interest on PVC alternatives, two projects were initiated by iNEMI and HDPUG to address these areas. Both of these projects were chaired by Dell Inc. admin created BFR/PVC Cables & Wires HDP-iNEMI Whitepaper

    [Public] admin created BFR/PVC Cables & Wires HDP-iNEMI Whitepaper

    March 29, 2017 - 8:53am
    admin created BFR/PVC Cables & Wires HDP-iNEMI Whitepaper

     

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Tuesday, March 28

Thursday, March 23

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    3:05pm
    [Public] Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016 March 23, 2017 - 3:05pm

    [Public] Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016

    March 23, 2017 - 3:05pm
    Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016

     

    Changes to Title
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    ECM Paper Published at APEX February 2016
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    Electro-Chemical Migration Paper Published at APEX February 2016
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    ECM Paper Published at APEX February 2016
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    Electro-Chemical Migration Paper Published at APEX February 2016
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    3:02pm
    [Public] Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016 March 23, 2017 - 3:02pm

    [Public] Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016

    March 23, 2017 - 3:02pm
    Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016

     

    Changes to Title
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    Electro-Chemical Migration Paper Published at APEX February 2016
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    ECM Paper Published at APEX February 2016
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    Electro-Chemical Migration Paper Published at APEX February 2016
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    ECM Paper Published at APEX February 2016
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    2:55pm
    [Public] Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016 March 23, 2017 - 2:55pm

    [Public] Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016

    March 23, 2017 - 2:55pm
    Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016

     

    Changes to Title
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    zlectro-Chemical Migration Paper Published at APEX February 2016
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    Electro-Chemical Migration Paper Published at APEX February 2016
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    zlectro-Chemical Migration Paper Published at APEX February 2016
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    Electro-Chemical Migration Paper Published at APEX February 2016
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    2:52pm
    [Public] Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016 March 23, 2017 - 2:52pm

    [Public] Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016

    March 23, 2017 - 2:52pm
    Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016

     

    Changes to Title
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    Electro-Chemical Migration Paper Published at APEX February 2016
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    zlectro-Chemical Migration Paper Published at APEX February 2016
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    Electro-Chemical Migration Paper Published at APEX February 2016
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    zlectro-Chemical Migration Paper Published at APEX February 2016
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    10:45am
    [Public] admin updated Electro-Chemical Paper Published at SMTAI 2015 March 23, 2017 - 10:45am

    [Public] admin updated Electro-Chemical Paper Published at SMTAI 2015

    March 23, 2017 - 10:45am
    admin updated Electro-Chemical Paper Published at SMTAI 2015

     

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    *Electronic Assembly Pitting / Crevice Corrosion Research*
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    *ABSTRACT*
     
    *ABSTRACT*
     
     
     
     
     
    Pitting or crevice corrosion on printed circuit boards has not been well studied in the industry. This mechanism has been seen at small solder mask openings near circuit traces on printed circuit boards when stored or shipped in a humid environment with soldering fluxes that pass all standard tests. Failure modes are theorized to be driven by openings or defects in solder masks, voltage bias, flux activity and humidity levels. The High Density Packaging User Group Consortium is investigating this failure mechanism and the factors that cause the defect to occur.
     
    Pitting or crevice corrosion on printed circuit boards has not been well studied in the industry. This mechanism has been seen at small solder mask openings near circuit traces on printed circuit boards when stored or shipped in a humid environment with soldering fluxes that pass all standard tests. Failure modes are theorized to be driven by openings or defects in solder masks, voltage bias, flux activity and humidity levels. The High Density Packaging User Group Consortium is investigating this failure mechanism and the factors that cause the defect to occur.
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    Pitting / crevice corrosion is different than the well-studied electrochemical migration dendritic corrosion events. Test vehicles used to simulate pitting / crevice corrosion...
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    10:43am
    [Electro-Chemical Migration] admin created Electro-Chemical Paper Published at SMTAI 2015 March 23, 2017 - 10:43am

    [Electro-Chemical Migration] admin created Electro-Chemical Paper Published at SMTAI 2015

    March 23, 2017 - 10:43am
    admin created Electro-Chemical Paper Published at SMTAI 2015

     

    Electronic Assembly Pitting / Crevice Corrosion Research

     

    ABSTRACT

     

    Pitting or crevice corrosion on printed circuit boards has not been well studied in the industry. This mechanism has been seen at small solder mask openings near circuit traces on printed circuit boards when stored or shipped in a humid environment with soldering fluxes that pass all standard tests. Failure modes are theorized to be driven by openings or defects in solder masks, voltage bias, flux activity and humidity levels. The High Density Packaging User Group Consortium is investigating this failure mechanism and the factors that cause the defect to occur.

    Pitting / crevice corrosion is different than the well-studied electrochemical migration dendritic corrosion events. Test vehicles used to simulate pitting / crevice corrosion failure have been designed. Experiments to test the research hypothesis that pitting / crevice corrosion can occur on printed circuit boards soldered with no-clean wave fluxes are in progress and results to date will be documented in this research paper. This paper covers the correlation phase by comparing and contrasting existing IPC Test Methods to a newly designed Pitting / Crevice Corrosion test method.

    A description of the mechanism, data findings, inferences from the data findings and follow on research plans are reported in this paper.

     

    ...
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    10:31am
    [Public] admin updated Electro-Chemical Migration Paper Published at APEX February 2016 March 23, 2017 - 10:31am

    [Public] admin updated Electro-Chemical Migration Paper Published at APEX February 2016

    March 23, 2017 - 10:31am
    admin updated Electro-Chemical Migration Paper Published at APEX February 2016

     

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    File: Pitting - Crevice Corrosion Research Paper 02-10-16 Final_0.pdf
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    File: Pitting - Crevice Corrosion Research Paper 02-10-16 Final_0.pdf
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    10:30am
    [Public] admin updated Electro-Chemical Migration Paper Published at APEX February 2016 March 23, 2017 - 10:30am

    [Public] admin updated Electro-Chemical Migration Paper Published at APEX February 2016

    March 23, 2017 - 10:30am
    admin updated Electro-Chemical Migration Paper Published at APEX February 2016

     

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    *Test Method Development for Detecting Pitting / Crevice Corrosion Formation on Electronic Assemblies*
     
    *Test Method Development for Detecting Pitting / Crevice Corrosion Formation on Electronic Assemblies*
     
     
     
     
     
     
     
     
     
    Pitting/Crevice corrosion on printed circuit boards has not been well studied in the industry.  This mechanism has been seen at small solder mask openings near circuit traces on printed circuit boards when stored or shipped in a humid environment with no-clean soldering fluxes that passed all standard tests.  Failure modes are theorized to be driven by openings or defects in solder masks and humidity levels that mobilized surface contamination.  Harsh environments, which can bring in outside contaminants, can be one of the factors that causes pitting corrosion to initiate and grow.
     
    Pitting/Crevice corrosion on printed circuit boards has not been well studied in the industry.  This mechanism has been seen at small solder mask openings near circuit traces on printed circuit boards when stored or shipped in a humid environment with no-clean soldering fluxes that passed all standard tests.  Failure modes are theorized to be driven by openings or defects in solder masks and humidity levels that mobilized surface contamination.  Harsh environments, which can bring in outside contaminants, can be one of the factors that causes pitting corrosion to initiate and grow.
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     ...
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    10:29am
    [Public] admin created Electro-Chemical Migration Paper Published at APEX February 2016 March 23, 2017 - 10:29am

    [Public] admin created Electro-Chemical Migration Paper Published at APEX February 2016

    March 23, 2017 - 10:29am
    admin created Electro-Chemical Migration Paper Published at APEX February 2016

     

    Test Method Development for Detecting Pitting / Crevice Corrosion Formation on Electronic Assemblies

     

    Abstract

     

    Pitting/Crevice corrosion on printed circuit boards has not been well studied in the industry.  This mechanism has been seen at small solder mask openings near circuit traces on printed circuit boards when stored or shipped in a humid environment with no-clean soldering fluxes that passed all standard tests.  Failure modes are theorized to be driven by openings or defects in solder masks and humidity levels that mobilized surface contamination.  Harsh environments, which can bring in outside contaminants, can be one of the factors that causes pitting corrosion to initiate and grow.

    In many of the applications employing high density assemblies processed with mixed technology, the quality of the laminate construction, the assembly process and quality of design are critical.  Solder mask type (glossy or matte,) curing and application process have been known to cause corrosion issues.  Often the soldermask employed (manufacturer, chemical structure, Tg, filler type and thickness) can be factors that lead to pitting corrosion and should be understood.  In some cases, the thickness, quality and roughness of the copper at the surface can contribute to corrosion.

    ...
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    10:26am
    [Public] admin created HDP User Group Published Papers and Presentations March 23, 2017 - 10:26am

    [Public] admin created HDP User Group Published Papers and Presentations

    March 23, 2017 - 10:26am
    admin created HDP User Group Published Papers and Presentations

     

    Click link to see abstract

    Click link to see abstract

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