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Thursday, November 9

Thursday, October 19

  • Your profile picture
    9:41am
    [Public] admin updated December 12 & 13, 2017 Asia Meeting October 19, 2017 - 9:41am

    [Public] admin updated December 12 & 13, 2017 Asia Meeting

    October 19, 2017 - 9:41am
    admin updated December 12 & 13, 2017 Asia Meeting

     

    Changes to Members only
     
     
     
    * Mini Power Cycles [9]
     
    * Mini Power Cycles [9]
    -
    * Low Ag Alloy Solder Paste Reliability
    +
    * Low Ag Alloy Solder Paste Reliability [10]
    -
    * Lead Free PWB Materials Reliability Phase 5
    +
    * Lead Free PWB Materials Reliability Phase 5 [11]
     
     
     
    10:15 Break (30 minutes)
     
    10:15 Break (30 minutes)
     
    10:45 PWB Technology
     
    10:45 PWB Technology
     
     
    -
    * Board Thickness Effect on ATC Reliability
    +
    * Board Thickness Effect on ATC Reliability [12]
    -
    * Future HDI
    +
    * Future HDI [13]
    -
    * PWB Environmental Life Cycle Analysis 2
    ...
    Read more
  • Your profile picture
    9:33am
    [Public] admin updated December 12 & 13, 2017 Asia Meeting October 19, 2017 - 9:33am

    [Public] admin updated December 12 & 13, 2017 Asia Meeting

    October 19, 2017 - 9:33am
    admin updated December 12 & 13, 2017 Asia Meeting

     

    Changes to Members only
     
    9:30 Assembly and Pb Free Projects
     
    9:30 Assembly and Pb Free Projects
     
     
    -
    * Electro-Chemical Migration 2
    +
    * Electro-Chemical Migration 2 [1]
    -
    * Harsh Use Environment Alloy Evaluation
    +
    * Harsh Use Environment Low-Halogen Reliability [2]
    -
    * Solder Joint Reliability with Surface Finishes
    +
    * Solder Joint Reliability with Surface Finishes [3]
     
     
     
    10:30 Group Picture & Break (30 minutes)
     
    10:30 Group Picture & Break (30 minutes)
     
    11:00 Emerging Technology Projects
     
    11:00 Emerging Technology Projects
     
     
    -
    * Harsh Use Halogen Free Laminate Evaluation
    +
    * DISC 2 [4]...
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  • Your profile picture
    9:22am
    [Public] admin updated December 12 & 13, 2017 Asia Meeting October 19, 2017 - 9:22am

    [Public] admin updated December 12 & 13, 2017 Asia Meeting

    October 19, 2017 - 9:22am
    admin updated December 12 & 13, 2017 Asia Meeting

     

    Changes to Members only
     
    9:30 Assembly and Pb Free Projects
     
    9:30 Assembly and Pb Free Projects
     
     
    -
    * Electro-Chemical Migration 2
    +
    * Electro-Chemical Migration 2
    -
    * Harsh Use Environment Alloy Evaluation
    +
    * Harsh Use Environment Alloy Evaluation
    -
    * Solder Joint Reliability with Surface Finishes–
    +
    * Solder Joint Reliability with Surface Finishes
     
     
     
    10:30 Group Picture & Break (30 minutes)
     
    10:30 Group Picture & Break (30 minutes)
     
    11:00 Emerging Technology Projects
     
    11:00 Emerging Technology Projects
     
     
    -
    * Harsh Use Halogen Free Laminate Evaluation
    +
    * Harsh Use Halogen Free Laminate Evaluation
    ...
    Read more
  • Your profile picture
    9:19am
    [Public] admin updated December 12 & 13, 2017 Asia Meeting October 19, 2017 - 9:19am

    [Public] admin updated December 12 & 13, 2017 Asia Meeting

    October 19, 2017 - 9:19am
    admin updated December 12 & 13, 2017 Asia Meeting

     

    ...
    Changes to Members only
     
    www.newotani.co.jp/makuhari
     
    www.newotani.co.jp/makuhari
     
     
    -
    *Agenda Topics*
    +
    *Tentative Agenda*
    -
    *Day 1 - Invited Guests and Members*
    +
    *Tuesday, December 12 - Invited Guests and Members*
    -
    • Overview of HDP – How HDP projects work and how you can participate.
      
     
     
    -
    • Solder Joint Reliability with New Surface Finishes [1] - This project
    +
    8:30 Registration, coffee and socializing
    -
    serves to evaluate the toughness of solder joints on boards, coated with
    +
    9:00 Opening of the meeting – Larry Marcanti, HDP User Group
    -
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Tuesday, October 3

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    10:49am
    [Public] admin created HDP User Group Announces New Project October 3, 2017 - 10:49am

    [Public] admin created HDP User Group Announces New Project

    October 3, 2017 - 10:49am
    admin created HDP User Group Announces New Project

     

    Cave Creek, Arizona April 26, 2017. High Density Packaging (HDP) User Group is pleased to announce the initiation of a new project that is open for industry participation, CAF TV for Material Characterization. “Conductive Anodic Filamentation (CAF) manifests as an abrupt unpredictable loss of insulation resistance in electronic circuits during use. This project will focus on material screening to assess susceptibility before the material is used to build product” said Alun Morgan project facilitator.
     
    CAF is normally characterized as an effect subject to the influences of design, process and materials. This adds complexity to product development for laminate manufactures as lengthy failure analysis is normally required when CAF testing is performed using existing test vehicles. The project aim is to develop a test vehicle that will allow performance evaluation to be limited to laminate material only, thus eliminating the variables of design and process. It is expected that the project will lead to more focused and quicker laminate testing and development for CAF resistance, leading to lower cost and time to market for manufacturers, and lower cost and improve reliability of electronic products for consumers.
     
    To join this project go to the project page on the HDP website.   http://hdpug.org/caf-tv-material-characterization
     
    About HDP User Group
     
    HDP User Group (www.hdpug.org) is a global research and development organization based in Cave Creek Arizona, is dedicated to “reducing the costs and risks for the Electronics Manufacturing industry when using advanced electronic packaging and assembly”.  This international industry led group organizes and conducts R&D programs to address the technical issues facing the industry, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance.  HDP User Group maintains additional offices in Austin, Texas, Singapore, and Dollar, U.K. 
     
    For more information, visit HDP User Group on the Internet at www.hdpug.org  or contact Darryl Reiner at darrylr@hdpug.org, phone number +1 480-951-1963

    Cave Creek, Arizona April 26, 2017. High Density Packaging (HDP) User Group is pleased to announce the initiation of a new project that is open for industry participation, CAF TV for Material Characterization. “Conductive Anodic Filamentation (CAF) manifests as an abrupt unpredictable loss of insulation...

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  • Your profile picture
    10:46am
    [Public] admin created HDP User Group Announces New Industry Wide Projects October 3, 2017 - 10:46am

    [Public] admin created HDP User Group Announces New Industry Wide Projects

    October 3, 2017 - 10:46am
    admin created HDP User Group Announces New Industry Wide Projects

     

    Cave Creek, Arizona April 11, 2017. High Density Packaging (HDP) User Group headquartered in the United States is pleased to announce the initiation of four new projects which are open for industry participation. “HDP User Group projects are based on problems and ideas our members bring forward. HDP has members on all tiers of the supply chain, which translates into solutions that the industry can implement quickly”, said Marshall Andrews Executive Director of the organization.

    Digital Image Speckle Correlation (DISC) 2

    This project will be a continuation of the DISC Project, using additional stackups from the recently completed Multi-lam project. The Team will expand the scope of structures to include 2-4 stack on 12, 18 and 24 layer Printed Wiring Boards (PWBs) to test repeatability of the Digital Speckle method. This project creates and compares empirical data used in available Finite Element Modeling (FEM) tools such as CALCE and Sherlock, thereby improving the accuracy of these tools and expanding our understanding of the physical forces influencing the reliability of electronic products.

    To join the project and for updated project information you can visit the project page on the HDP User Group website: http://hdpug.org/digital-image-specklecorrelation-2.

    Military Halogen Free Laminate Evaluation

    HDP User Group has completed several projects evaluating the latest lead free PWB laminate materials available to the market using general commercial specifications and criteria. This project will evaluate PWB laminate materials using Military/Aerospace specifications and criteria.  Military/Aerospace requirements are different from commercial, and in some cases more stringent.  Selection of the proper PWB material for the application can, in many cases, be mission critical.

    To join the project and for updated project information you can visit the project page on the HDP website: http://hdpug.org/military-halogen-free-laminateevaluation

    Better CAF Acceleration Equation

    Classic CAF (Conductive Anodic Filament) growth is a two-step process; firstly the creation of a pathway by hydrolysis, followed by electrochemical filament growth. Where there is no pathway there can be no CAF,...

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  • Your profile picture
    9:31am
    [Public] admin updated HDP September 27 & 28, 2017 Annual Fall Meeting October 3, 2017 - 9:31am

    [Public] admin updated HDP September 27 & 28, 2017 Annual Fall Meeting

    October 3, 2017 - 9:31am
    admin updated HDP September 27 & 28, 2017 Annual Fall Meeting

     

    Changes to Attachments
     
    File: Day_1_Presentations.pdf
     
    File: Day_1_Presentations.pdf
      +
    File: Day_2_Presentations.pdf
    Changes to Attachments
     
    File: Day_1_Presentations.pdf
     
    File: Day_1_Presentations.pdf
      +
    File: Day_2_Presentations.pdf
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  • Your profile picture
    9:30am
    [Public] admin updated HDP September 27 & 28, 2017 Annual Fall Meeting October 3, 2017 - 9:30am

    [Public] admin updated HDP September 27 & 28, 2017 Annual Fall Meeting

    October 3, 2017 - 9:30am
    admin updated HDP September 27 & 28, 2017 Annual Fall Meeting

     

    Changes to Attachments
    -
     
    +
    File: Day_1_Presentations.pdf
    Changes to Attachments
    -
     
    +
    File: Day_1_Presentations.pdf
    Read more
  • Your profile picture
    7:58am
    [Public] admin updated December 12 & 13, 2017 Asia Meeting October 3, 2017 - 7:58am

    [Public] admin updated December 12 & 13, 2017 Asia Meeting

    October 3, 2017 - 7:58am
    admin updated December 12 & 13, 2017 Asia Meeting

     

    Changes to Members only
     
     
     
    *Day 2 – Members Only*
     
    *Day 2 – Members Only*
    -
    • FCBGA Package Warpage 2 – With the introduction of area array packages,
      
    -
    QFNs, stacked packages, etc. the flatness of packages and boards becomes
      
    -
    critical. Too much warpage and the short interconnections will never mate or
      
    -
    will poorly mate resulting in either an open or very weak joint. With the ICs
      
    -
    used becoming increasingly thinner, the silicon has less impact on resisting
      
    -
    deformation of the package. The net result is that warpage will become an
      
    -
    increasing problem in the future. The aim of this project is to quantify the
      
    -
    problem and to investigate possible commercially viable solutions to address
      
    -
    the issue. Phase 2 will establish the maximum warp an optimized process can
      
    -...
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  • Your profile picture
    7:48am
    [Public] admin updated December 12 & 13, 2017 Asia Meeting October 3, 2017 - 7:48am

    [Public] admin updated December 12 & 13, 2017 Asia Meeting

    October 3, 2017 - 7:48am
    admin updated December 12 & 13, 2017 Asia Meeting

     

    Changes to Members only
     
    joints.
     
    joints.
     
     
    -
    • RF Failure Detection - RF measurements of signal paths are far more
    +
    • RF Failure Detection [2] - RF measurements of signal paths are far more
     
    sensitive to incipient circuit (or solder joint) failure than our standard
     
    sensitive to incipient circuit (or solder joint) failure than our standard
     
    resistance measurements or
     
    resistance measurements or
     
    RF measurement to event detection.
     
    RF measurement to event detection.
     
     
    -
    • Electro-Chemical Migration 2 - This is the next phase of the very
    +
    • Electro-Chemical Migration 2 [3] - This is the next phase of the very
     
    successful ECM – 1 project which demonstrated the ability of the test
     
    successful ECM – 1 project which demonstrated the ability of the test
     
    vehicle to identify Pitting/Crevice type corrosion in the presence of
     
    vehicle to...
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  • Your profile picture
    7:44am
    [Public] admin updated December 12 & 13, 2017 Asia Meeting October 3, 2017 - 7:44am

    [Public] admin updated December 12 & 13, 2017 Asia Meeting

    October 3, 2017 - 7:44am
    admin updated December 12 & 13, 2017 Asia Meeting

     

    Changes to Members only
     
    *Day 1 - Invited Guests and Members*
     
    *Day 1 - Invited Guests and Members*
     
    • Overview of HDP – How HDP projects work and how you can participate.
     
    • Overview of HDP – How HDP projects work and how you can participate.
    -
    • Solder Joint Reliability with New Surface Finishes - This project serves
    +
     
    -
    to evaluate the toughness of solder joints on boards, coated with various
    +
    • Solder Joint Reliability with New Surface Finishes [1] - This project
    -
    surface finishes, and assembled with large components and fine-pitch
    +
    serves to evaluate the toughness of solder joints on boards, coated with
      +
    various surface finishes, and assembled with large components and fine-pitch
     
    components using different solder alloys used in harsh-use environment. The
     
    components using different solder alloys used in harsh-use environment. The
     
    assembled boards will go through thermal cycling and vibration tests (latter
     
    assembled boards...
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  • Your profile picture
    7:41am
    [Public] admin updated December 12 & 13, 2017 Asia Meeting October 3, 2017 - 7:41am

    [Public] admin updated December 12 & 13, 2017 Asia Meeting

    October 3, 2017 - 7:41am
    admin updated December 12 & 13, 2017 Asia Meeting

     

    ...
    Changes to Members only
     
    The HDP User Group 2017 Asia Meeting will be held in Japan, hosted by
     
    The HDP User Group 2017 Asia Meeting will be held in Japan, hosted by
    -
    Shikoku.  The meeting will be December 12 & 13, 2017.  Additional meeting
    +
    Shikoku. The meeting will be December 12 & 13, 2017. Additional meeting
    -
    information will be posted as it becomes available.  Registration is already
    +
    information will be posted as it becomes available. Registration is already
    -
    available.  To register for the meeting complete the below information and
    +
    available. To register for the meeting complete the below information and
     
    submit it to the HDP Administrator, Kim Andrews, at kima77@hdpug.org.
     
    submit it to the HDP Administrator, Kim Andrews, at kima77@hdpug.org.
     
     
     
    ___ I will attend Day 1 only, December 12 (members and invited guests)
     
    ___ I will attend Day 1 only, December 12 (members and invited guests)
    -
      
     
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Friday, September 22

  • Your profile picture
    9:37am
    [Public] admin updated HDP September 27 & 28, 2017 Annual Fall Meeting September 22, 2017 - 9:37am

    [Public] admin updated HDP September 27 & 28, 2017 Annual Fall Meeting

    September 22, 2017 - 9:37am
    admin updated HDP September 27 & 28, 2017 Annual Fall Meeting

     

    ...
    Changes to Members only
     
    Ottawa, ON K2T 1E6
     
    Ottawa, ON K2T 1E6
     
    Telephone: 613-271-3057
     
    Telephone: 613-271-3057
      +
      +
    *Meeting Call-In Information*
      +
      +
    Member meeting Ottawa Day 1
      +
    Wednesday, September 27, 2017
      +
    6:00 am  |  Central Daylight Time (Chicago, GMT-05:00)  |  11 hrs
      +
      +
    Normal
      +
    0
      +
      +
      +
      +
    Read more
  • Your profile picture
    9:22am
    [Public] admin updated HDP September 27 & 28, 2017 Annual Fall Meeting September 22, 2017 - 9:22am

    [Public] admin updated HDP September 27 & 28, 2017 Annual Fall Meeting

    September 22, 2017 - 9:22am
    admin updated HDP September 27 & 28, 2017 Annual Fall Meeting

     

    Changes to Members only
     
    The HDP User Group 2017 Annual Fall Meeting will be held in Ottawa, ON,
     
    The HDP User Group 2017 Annual Fall Meeting will be held in Ottawa, ON,
     
    Canada hosted by Curtiss-Wright .  The meeting will be September 27 & 28,
     
    Canada hosted by Curtiss-Wright .  The meeting will be September 27 & 28,
    -
    2017.  Additional meeting information will be posted as it becomes
    +
    2017. 
    -
    available.  To register for the meeting complete the below information and
      
    -
    submit it to the HDP Administrator, Kim Andrews, at kima77@hdpug.org [1].
      
    -
     
      
    -
    ___ I will attend Day 1 only, September 27 (members and invited guests)
      
    -
     
      
    -
    ___ I will attend Day 2 only, September 28 (members only)
      
    -
     
      ...
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Wednesday, August 16

  • Your profile picture
    10:45am
    [Public] admin updated HDP September 27 & 28, 2017 Annual Fall Meeting August 16, 2017 - 10:45am

    [Public] admin updated HDP September 27 & 28, 2017 Annual Fall Meeting

    August 16, 2017 - 10:45am
    admin updated HDP September 27 & 28, 2017 Annual Fall Meeting

     

    Changes to Members only
     
    font-family:"Times New Roman",serif;}
     
    font-family:"Times New Roman",serif;}
     
     
    -
    Please have them refer to the Curtiss Wright block – block code VG2
    +
    Please refer to the Curtiss Wright block – block code VG2
     
     
     
    The last day for reservations is approaching.  Please have reservation
     
    The last day for reservations is approaching.  Please have reservation
     
    * PTH Creep Fatigue Under Roughness Influence [2] –Yoshi Hiroshima,
     
    * PTH Creep Fatigue Under Roughness Influence [2] –Yoshi Hiroshima,
     
    Fujitsu / Jack Tan, HDP
     
    Fujitsu / Jack Tan, HDP
    -
    * Harsh Use Halogen Free Laminate Evaluation - Jack Fisher, HDP
    +
    * Harsh Use Halogen Free Laminate Evaluation [3] - Jack Fisher, HDP
    -
    * DISC 2 [3] – Thilo Sack, Celestica
    +
    * DISC 2 [4] – Thilo Sack, Celestica
    ...
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  • Your profile picture
    10:40am
    [Public] admin updated HDP September 27 & 28, 2017 Annual Fall Meeting August 16, 2017 - 10:40am

    [Public] admin updated HDP September 27 & 28, 2017 Annual Fall Meeting

    August 16, 2017 - 10:40am
    admin updated HDP September 27 & 28, 2017 Annual Fall Meeting

     

    Changes to Members only
     
     
     
    Please have them refer to the Curtiss Wright block – block code VG2
     
    Please have them refer to the Curtiss Wright block – block code VG2
      +
      +
    The last day for reservations is approaching.  Please have reservation
      +
    requests submitted by August 28th.
     
     
     
    Holiday Inn & Suites Ottawa Kanata
     
    Holiday Inn & Suites Ottawa Kanata
     
     
     
    Projects Review/Status Update: Chair: Jack Fisher, HDP User Group
     
    Projects Review/Status Update: Chair: Jack Fisher, HDP User Group
    -
    9:30 High Frequency Projects
    +
    9:30 Emerging Technology Projects
    -
     
      
    -
    * RF Failure Detection [2] – Yaw Obeng, NIST /...
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Tuesday, July 11

  • Your profile picture
    8:47am
    [Public] admin updated HDP September 27 & 28, 2017 Annual Fall Meeting July 11, 2017 - 8:47am

    [Public] admin updated HDP September 27 & 28, 2017 Annual Fall Meeting

    July 11, 2017 - 8:47am
    admin updated HDP September 27 & 28, 2017 Annual Fall Meeting

     

    Changes to Members only
     
    101 Kanata Avenue
     
    101 Kanata Avenue
     
    Ottawa, ON K2T 1E6
     
    Ottawa, ON K2T 1E6
    -
    Telephone: 613-254-5101
    +
    Telephone: 613-271-3057
     
     
     
    *Tentative Agenda
     
    *Tentative Agenda
    Changes to Members only
     
    101 Kanata Avenue
     
    101 Kanata Avenue
     
    Ottawa, ON K2T 1E6
     
    Ottawa, ON K2T 1E6
    -
    Telephone: 613-254-5101
    +
    Telephone: 613-271-3057
     
     
     
    *Tentative...
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  • Your profile picture
    8:10am
    [Public] admin updated HDP September 27 & 28, 2017 Annual Fall Meeting July 11, 2017 - 8:10am

    [Public] admin updated HDP September 27 & 28, 2017 Annual Fall Meeting

    July 11, 2017 - 8:10am
    admin updated HDP September 27 & 28, 2017 Annual Fall Meeting

     

    ...
    Changes to Members only
     
    reservation please contact the HDP Administrator at kima77@hdpug.org and
     
    reservation please contact the HDP Administrator at kima77@hdpug.org and
     
    provide your check-in and check-out dates.
     
    provide your check-in and check-out dates.
      +
      +
    Normal
      +
    0
      +
      +
      +
      +
      +
    false
      +
    false
      +
    false
      +
      +
    EN-US
      
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Wednesday, June 28

  • Your profile picture
    11:44am
    [Public] admin updated HDP September 27 & 28, 2017 Annual Fall Meeting June 28, 2017 - 11:44am

    [Public] admin updated HDP September 27 & 28, 2017 Annual Fall Meeting

    June 28, 2017 - 11:44am
    admin updated HDP September 27 & 28, 2017 Annual Fall Meeting

     

    Changes to Members only
     
    9:30 High Frequency Projects
     
    9:30 High Frequency Projects
     
     
    -
    * RF Failure Detection – Yaw Obeng, NIST / Bev Christian, HDP
    +
    * RF Failure Detection [2] – Yaw Obeng, NIST / Bev Christian, HDP
    -
    * HF Loss from Cu Topology – Karl Sauter, Oracle / John Davignon, HDP
    +
    * HF Loss from Cu Topology [3] – Karl Sauter, Oracle / John Davignon, HDP
     
     
     
    10:10 Emerging Technology Projects
     
    10:10 Emerging Technology Projects
     
     
    -
    * PTH Creep Fatigue Under Roughness Influence [2] –Yoshi Hiroshima,
    +
    * PTH Creep Fatigue Under Roughness Influence [4] –Yoshi Hiroshima,
     
    Fujitsu / Jack Tan, HDP
     
    Fujitsu / Jack Tan, HDP
     
     
     ...
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