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Tuesday, April 25

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    10:49am
    [Public] admin created Ultra-Thin HDI Multi-Purpose Test Vehicle Paper SMTAi September 2016 April 25, 2017 - 10:49am ABSTRACT In the last decade, the Ultra-Thin HDI (High Density Interconnect) technology has dominated the mobile/wearable products designs, yet the standard test vehicles used for qualifying materials, components and connectors provided by IPC (Institute of Printed Circuits), ANSI (American National Standard Institute) and JEDEC (Joint Electron Device Engineering Council aka Solid State Technology Association), are obsolete and OEM’s (Original Equipment Manufacturer) have stopped using them. These test vehicles do not reflect the form factors, density and interconnect methods used by the industry. In addition, they do not capture failure modes of the fine pitch BGA (Ball Grid Array) technology and as a result don’t provide upstream Users adequate data for development. Microvias and dielectrics are the key, along with finer lines and spaces, in obtaining the density of Ultra-Thin HDI boards. Continuous reduction in PCB dimensions and feature sizes challenges both fabrication process and test vehicles. HDP User Group’s paper gives a brief introduction to the modern Ultra-Thin PCB (Printed Circuit Board) fabrication process.  It discusses typical board level reliability tests and presents a generic reliability test vehicle design which is based on current Ultra-Thin HDI technology. With the proposed test vehicles’ design of modularity and scalability it is easy to modify to meet the next generation of Ultra-Thin HDI PCB requirements. The study indicates that the proposed TV design covers HDI test requirements and most of the current tests are critical when evaluating modern Ultra-Thin HDI circuit board reliability. The HDP User Group project also conducted a study on the application and reliability of a very fine pitch WLCSP (Wafer Level Chip Scale Package) on this Ultra-Thin HDI test vehicle. A 0.3mm pitch WLCSP daisy chain, commercially available solder paste, flux and underfill were used for this study. The details of the assembly process including solder paste printing, dip flux, component placement, reflow and underfill dispensing are discussed. The impact of the test vehicle OSP (Organic Surface Protection) surface finish on the assembly process and result is addressed as well. JEDEC standard air-to-air thermal cycling and drop tests are performed for reliability evaluation purposes. The reliability data of solder paste printing vs. dip flux, underfill vs. non-underfill are compared and evaluated. All results show that the WLCSP application process and materials on the ultra-thin test vehicle are robust and reliable. admin created Ultra-Thin HDI Multi-Purpose Test Vehicle Paper SMTAi September 2016

    [Public] admin created Ultra-Thin HDI Multi-Purpose Test Vehicle Paper SMTAi September 2016

    April 25, 2017 - 10:49am
    admin created Ultra-Thin HDI Multi-Purpose Test Vehicle Paper SMTAi September 2016

     

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    10:35am
    [Public] admin created Smooth Copper Signal Integrity Paper Published at IPC APEX 2017 April 25, 2017 - 10:35am Abstract High Density Packaging (HDP) User Group has completed a project evaluating the high frequency loss impacts of a variety of imaged core surface treatments (bond enhancement treatments, including chemical bonding and newer low etch alternative oxides) applied just prior to press lamination. Initial high frequency Dk/Df electrical test results did not show a strong correlation with any of the methods utilized within this project to measured surface roughness. The more significant factor affecting the measured loss is the choice of pre-lamination surface treatment. Most of the new chemical treatment systems outperform the older existing systems which depend upon surface roughness techniques to promote adhesion. admin created Smooth Copper Signal Integrity Paper Published at IPC APEX 2017

    [Public] admin created Smooth Copper Signal Integrity Paper Published at IPC APEX 2017

    April 25, 2017 - 10:35am
    admin created Smooth Copper Signal Integrity Paper Published at IPC APEX 2017

     

    This is the paper written and published at APEX 2017 by Jim Fuller (Sanmina) and Karl Sauter (Oracle).

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Thursday, March 30

Wednesday, March 29

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    8:53am
    [Public] admin created BFR/PVC Cables & Wires HDP-iNEMI Whitepaper March 29, 2017 - 8:53am Halogens, and more specifically Bromine (Br) used as a flame retardant (BFRs) and Chlorine (Cl) used as a flame retardant and Polyvinyl Chloride (PVC), have been alleged to have a negative toxicological impact on human health and the environment in some studies. As a precautionary principle, many electronic manufacturers have publicly adopted initiatives to phase out the use of BFRs and PVC to potentially minimize the impact on the environment. The transition towards halogen free in electronics is dependent on commodity types. Certain commodities have drop-in replacement substances while others are challenged with performance, cost and availability. One type of commodity the industry continues to struggle with is PVC replacement on flexible cables and wires. Due to performance and safety requirements, the cable industry is challenged to find a robust and cost effective PVC replacement. To better understand if PVC alternatives are holistically more environmentally preferable than traditional PVC, a Life Cycle Assessment (LCA) is needed to assess other environmentally impactful attributes. As a result, to address industry wide interest on PVC alternatives, two projects were initiated by iNEMI and HDPUG to address these areas. Both of these projects were chaired by Dell Inc. admin created BFR/PVC Cables & Wires HDP-iNEMI Whitepaper

    [Public] admin created BFR/PVC Cables & Wires HDP-iNEMI Whitepaper

    March 29, 2017 - 8:53am
    admin created BFR/PVC Cables & Wires HDP-iNEMI Whitepaper

     

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Tuesday, March 28

Thursday, March 23

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    3:05pm
    [Public] Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016 March 23, 2017 - 3:05pm

    [Public] Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016

    March 23, 2017 - 3:05pm
    Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016

     

    Changes to Title
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    ECM Paper Published at APEX February 2016
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    Electro-Chemical Migration Paper Published at APEX February 2016
    Changes to Title
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    ECM Paper Published at APEX February 2016
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    Electro-Chemical Migration Paper Published at APEX February 2016
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    3:02pm
    [Public] Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016 March 23, 2017 - 3:02pm

    [Public] Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016

    March 23, 2017 - 3:02pm
    Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016

     

    Changes to Title
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    Electro-Chemical Migration Paper Published at APEX February 2016
    +
    ECM Paper Published at APEX February 2016
    Changes to Title
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    Electro-Chemical Migration Paper Published at APEX February 2016
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    ECM Paper Published at APEX February 2016
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    2:55pm
    [Public] Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016 March 23, 2017 - 2:55pm

    [Public] Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016

    March 23, 2017 - 2:55pm
    Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016

     

    Changes to Title
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    zlectro-Chemical Migration Paper Published at APEX February 2016
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    Electro-Chemical Migration Paper Published at APEX February 2016
    Changes to Title
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    zlectro-Chemical Migration Paper Published at APEX February 2016
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    Electro-Chemical Migration Paper Published at APEX February 2016
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  • Your profile picture
    2:52pm
    [Public] Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016 March 23, 2017 - 2:52pm

    [Public] Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016

    March 23, 2017 - 2:52pm
    Robert Smith updated Electro-Chemical Migration Paper Published at APEX February 2016

     

    Changes to Title
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    Electro-Chemical Migration Paper Published at APEX February 2016
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    zlectro-Chemical Migration Paper Published at APEX February 2016
    Changes to Title
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    Electro-Chemical Migration Paper Published at APEX February 2016
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    zlectro-Chemical Migration Paper Published at APEX February 2016
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    10:45am
    [Public] admin updated Electro-Chemical Paper Published at SMTAI 2015 March 23, 2017 - 10:45am

    [Public] admin updated Electro-Chemical Paper Published at SMTAI 2015

    March 23, 2017 - 10:45am
    admin updated Electro-Chemical Paper Published at SMTAI 2015

     

    Changes to Body
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    *Electronic Assembly Pitting / Crevice Corrosion Research*
      +
     
     
    *ABSTRACT*
     
    *ABSTRACT*
     
     
     
     
     
    Pitting or crevice corrosion on printed circuit boards has not been well studied in the industry. This mechanism has been seen at small solder mask openings near circuit traces on printed circuit boards when stored or shipped in a humid environment with soldering fluxes that pass all standard tests. Failure modes are theorized to be driven by openings or defects in solder masks, voltage bias, flux activity and humidity levels. The High Density Packaging User Group Consortium is investigating this failure mechanism and the factors that cause the defect to occur.
     
    Pitting or crevice corrosion on printed circuit boards has not been well studied in the industry. This mechanism has been seen at small solder mask openings near circuit traces on printed circuit boards when stored or shipped in a humid environment with soldering fluxes that pass all standard tests. Failure modes are theorized to be driven by openings or defects in solder masks, voltage bias, flux activity and humidity levels. The High Density Packaging User Group Consortium is investigating this failure mechanism and the factors that cause the defect to occur.
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    Pitting / crevice corrosion is different than the well-studied electrochemical migration dendritic corrosion events. Test vehicles used to simulate pitting / crevice corrosion...
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  • Your profile picture
    10:43am
    [Electro-Chemical Migration] admin created Electro-Chemical Paper Published at SMTAI 2015 March 23, 2017 - 10:43am

    [Electro-Chemical Migration] admin created Electro-Chemical Paper Published at SMTAI 2015

    March 23, 2017 - 10:43am
    admin created Electro-Chemical Paper Published at SMTAI 2015

     

    Electronic Assembly Pitting / Crevice Corrosion Research

     

    ABSTRACT

     

    Pitting or crevice corrosion on printed circuit boards has not been well studied in the industry. This mechanism has been seen at small solder mask openings near circuit traces on printed circuit boards when stored or shipped in a humid environment with soldering fluxes that pass all standard tests. Failure modes are theorized to be driven by openings or defects in solder masks, voltage bias, flux activity and humidity levels. The High Density Packaging User Group Consortium is investigating this failure mechanism and the factors that cause the defect to occur.

    Pitting / crevice corrosion is different than the well-studied electrochemical migration dendritic corrosion events. Test vehicles used to simulate pitting / crevice corrosion failure have been designed. Experiments to test the research hypothesis that pitting / crevice corrosion can occur on printed circuit boards soldered with no-clean wave fluxes are in progress and results to date will be documented in this research paper. This paper covers the correlation phase by comparing and contrasting existing IPC Test Methods to a newly designed Pitting / Crevice Corrosion test method.

    A description of the mechanism, data findings, inferences from the data findings and follow on research plans are reported in this paper.

     

    ...
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  • Your profile picture
    10:31am
    [Public] admin updated Electro-Chemical Migration Paper Published at APEX February 2016 March 23, 2017 - 10:31am

    [Public] admin updated Electro-Chemical Migration Paper Published at APEX February 2016

    March 23, 2017 - 10:31am
    admin updated Electro-Chemical Migration Paper Published at APEX February 2016

     

    Changes to Attachments
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    File: Pitting - Crevice Corrosion Research Paper 02-10-16 Final_0.pdf
    Changes to Attachments
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    +
    File: Pitting - Crevice Corrosion Research Paper 02-10-16 Final_0.pdf
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  • Your profile picture
    10:30am
    [Public] admin updated Electro-Chemical Migration Paper Published at APEX February 2016 March 23, 2017 - 10:30am

    [Public] admin updated Electro-Chemical Migration Paper Published at APEX February 2016

    March 23, 2017 - 10:30am
    admin updated Electro-Chemical Migration Paper Published at APEX February 2016

     

    Changes to Body
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    *Test Method Development for Detecting Pitting / Crevice Corrosion Formation on Electronic Assemblies*
     
    *Test Method Development for Detecting Pitting / Crevice Corrosion Formation on Electronic Assemblies*
     
     
     
     
     
     
     
     
     
    Pitting/Crevice corrosion on printed circuit boards has not been well studied in the industry.  This mechanism has been seen at small solder mask openings near circuit traces on printed circuit boards when stored or shipped in a humid environment with no-clean soldering fluxes that passed all standard tests.  Failure modes are theorized to be driven by openings or defects in solder masks and humidity levels that mobilized surface contamination.  Harsh environments, which can bring in outside contaminants, can be one of the factors that causes pitting corrosion to initiate and grow.
     
    Pitting/Crevice corrosion on printed circuit boards has not been well studied in the industry.  This mechanism has been seen at small solder mask openings near circuit traces on printed circuit boards when stored or shipped in a humid environment with no-clean soldering fluxes that passed all standard tests.  Failure modes are theorized to be driven by openings or defects in solder masks and humidity levels that mobilized surface contamination.  Harsh environments, which can bring in outside contaminants, can be one of the factors that causes pitting corrosion to initiate and grow.
    -
     
      
     ...
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  • Your profile picture
    10:29am
    [Public] admin created Electro-Chemical Migration Paper Published at APEX February 2016 March 23, 2017 - 10:29am

    [Public] admin created Electro-Chemical Migration Paper Published at APEX February 2016

    March 23, 2017 - 10:29am
    admin created Electro-Chemical Migration Paper Published at APEX February 2016

     

    Test Method Development for Detecting Pitting / Crevice Corrosion Formation on Electronic Assemblies

     

    Abstract

     

    Pitting/Crevice corrosion on printed circuit boards has not been well studied in the industry.  This mechanism has been seen at small solder mask openings near circuit traces on printed circuit boards when stored or shipped in a humid environment with no-clean soldering fluxes that passed all standard tests.  Failure modes are theorized to be driven by openings or defects in solder masks and humidity levels that mobilized surface contamination.  Harsh environments, which can bring in outside contaminants, can be one of the factors that causes pitting corrosion to initiate and grow.

    In many of the applications employing high density assemblies processed with mixed technology, the quality of the laminate construction, the assembly process and quality of design are critical.  Solder mask type (glossy or matte,) curing and application process have been known to cause corrosion issues.  Often the soldermask employed (manufacturer, chemical structure, Tg, filler type and thickness) can be factors that lead to pitting corrosion and should be understood.  In some cases, the thickness, quality and roughness of the copper at the surface can contribute to corrosion.

    ...
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    10:26am
    [Public] admin created HDP User Group Published Papers and Presentations March 23, 2017 - 10:26am

    [Public] admin created HDP User Group Published Papers and Presentations

    March 23, 2017 - 10:26am
    admin created HDP User Group Published Papers and Presentations

     

    Click link to see abstract

    Click link to see abstract

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    10:01am
    [Public] admin created HDP User Group Announces New High Frequency Measurement Project March 23, 2017 - 10:01am Cave Creek, Arizona November 10, 2016. The High Density Packaging (HDP) User GroupheadquarteredintheUnitedStatesispleasedtoannounceanewprojectthat willfocusonunderstandingtheimpactofmoistureonHighFrequencyMeasurements of printed circuit boardmaterial. Aselectronicproductsincreaseinfunctionalityandinterconnectspeedsapproach40 GB/sec, the need to measure substrate material performance becomes increasingly important anddemanding. Thisisthethirdprojectinthisseries.Phaseonereviewedandcomparedthedifferent types of high frequency test measurements that are used in the industry for measuringDielectricConstant(Dk)andDissapationfactor(Df)athigherfrequencies. Moisture content was identified as a significant factor in thetesting. Phase 2 was initiated to establish a test protocol for the accurate measurement of Dk, Df, and weight gain. Weight gain is used to measure moisture content. The objective of Phase 2 was only to establish a test protocol to accurately measure weight to 4 decimal places. Now that the measurement protocol has been verified, Phase 3 of this project proposes to evaluate the effect of moisture on each of the high frequency Dk andDf test methods. During the testing and analysis of the earlier phases of this project, it was determined that differences in moisture content were found to contribute up to a20percentdifferenceinthemeasuredDfvaluesofsomelaminatematerialstested. Phase 3 will use several laminates. Some low Df, some mid Df, and some highDf Please contact Jack Fisher at fish5er@hdpug.org to be added to project notification list and participation in this investigation. You will be informed of the next project call, tentatively to be held in early November. About HDP User Group HDPUserGroup(www.hdpug.org)isaglobalresearchanddevelopmentorganization based in Cave Creek Arizona, is dedicated to “reducing the costs and risks for the Electronics Manufacturing industry when using advanced electronic packaging and assembly”.    This  international  industry  led  group  organizes  and  conductsR&Dprograms to address the technical issues facing the industry, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance. HDP User Group maintains additional offices in Austin, Texas, Singapore, and Dollar, U.K. For more information, visit HDP User Group on the Internet at www.hdpug.org or contact Darryl Reiner at darrylr@hdpug.org, phone number +1 480-951-1963 admin created HDP User Group Announces New High Frequency Measurement Project

    [Public] admin created HDP User Group Announces New High Frequency Measurement Project

    March 23, 2017 - 10:01am
    admin created HDP User Group Announces New High Frequency Measurement Project

     

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    9:57am
    [Public] admin created HDP User Group Announces RBP Chemical Technology as its Newest Member March 23, 2017 - 9:57am Cave Creek, Arizona July 12, 2016. The High Density Packaging (HDP) User Group headquartered in the United States is pleased to announce that RBP Chemical Technology has become a member. “We are pleased to join HDPUG and contribute to the advancement of electronics packaging technology. RBP brings over 35 years of technique and know-how in a wide range of technologies used in the manufacturing of high reliability printed circuit boards, IC substrates and silicon based substrates. RBP’s expertise is in high density circuit formation, low profile adhesion promoters and surface treatment and passivation of metal surfaces ” said Michael Carano, V.P. Technology and Business Development for RBP Chemical Technology. “RBP Chemical Technology is an excellent addition to the HDP User Group Membership. The Staff and Members of our organization are looking forward to working with them on our projects and activities.”, said Marshall Andrews,  Executive Director of HDP User Group. As a Member, RBP Chemical Technology will join over 50 of the major companies involved in collaborative research addressing the major technical and environmental issues facing the electronics industry today. Their participation will complement the other member companies and help keep HDP User Group technical projects moving forward. About RBP Chemical Technology RBP Chemical Technology was founded in 1954. RBP develops, manufactures and specialty chemicals and processes used in the fabrication of printed circuit boards, semiconductors and IC substrates. Company expertise resides in surface preparation, metallization, circuit formation, HDI, solderability enhancement and processes for TSV and RDL. Further emphasis on processes to enhance signal integrity and long-term reliability. For more information, visit www.RBPchemical.com or contact Michael Carano at mcarano@rbpchemcial.net, +1 414.258.0911. About HDP User Group HDP User Group (www.hdpug.org) is a global research and development organization based in Cave Creek Arizona, is dedicated to “reducing the costs and risks for the Electronics Manufacturing industry when using advanced electronic packaging and assembly”. This international industry led group organizes and conducts R&D programs to address the technical issues facing the industry, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance. HDP User Group maintains additional offices in Austin, Texas, Singapore, and Dollar, U.K. For more information, visit HDP User Group on the Internet at www.hdpug.org or contact Darryl Reiner at darrylr@hdpug.org, phone number +1 480-951-1963   admin created HDP User Group Announces RBP Chemical Technology as its Newest Member

    [Public] admin created HDP User Group Announces RBP Chemical Technology as its Newest Member

    March 23, 2017 - 9:57am
    admin created HDP User Group Announces RBP Chemical Technology as its Newest Member

     

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Monday, March 20

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    10:46am
    [Public] admin created HDP User Group Announces MacDermid Enthone Electronics Solutions as its Newest Member March 20, 2017 - 10:46am Cave Creek, Arizona March 21, 2016. The High Density Packaging (HDP) User Group headquartered in the United States is pleased to announce that MacDermid Enthone Electronics Solutions has become a member.    “We are very interested in collaborating with other member companies, working together to overcome the technological challenges of next generation electronics, and providing high performance materials solutions for several of the HDP project programs.” said Michael Coll, Director of Electronics Specialties for MacDermid Enthone Electronics Solutions. MacDermid Enthone is a part of the MacDermid Performance Solutions group of businesses. “MacDermid Enthone Electronics Solutions is the newest member of HDP User Group. MacDermid Enthone has a long history of delivering advanced technologies to the industry.  We welcome their participation in our Smooth Copper Signal Integrity project which is studying the relationship between surface roughness measurements and  Insertion Loss of various copper surface finish treatments”, said Marshall Andrews, Executive Director of HDP User Group. As a Member, MacDermid Enthone will join over 50 of the major companies involved in the design and manufacturing of electronic products worldwide in addressing the major technical and environmental issues facing the industry today.  Their participation will complement the other member companies and help keep HDP User Group technical projects moving forward. About MacDermid Performance Solutions MacDermid Performance Solutions is a subsidiary of Platform Specialty Products Corporation. Our companies manufacture a broad range of specialty chemicals and materials which are used in multi-step technological processes that enhance the products people use every day. Our innovative materials and processes are creating more opportunities and efficiencies for companies across key industries – including electronics, graphic arts, metal & plastic plating, and offshore oil production. For more information, visit www.MacDermidPerformanceSolutions.com or contact Don Cullen at Donald.Cullen@MacDermid.com, +1 203.575.5700. About HDP User Group HDP User Group (www.hdpug.org) is a global research and development organization based in Cave Creek Arizona, is dedicated to “reducing the costs and risks for the Electronics Manufacturing industrywhen using advanced electronic packaging and assembly”.  This international industry led group organizes and conducts R&D programs to address the technical issues facing the industry, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance.  HDP User Group maintains additional offices in Austin, Texas, Singapore, and Dollar, U.K. For more information, visit HDP User Group on the Internet at www.hdpug.org or contact Darryl Reiner at darrylr@hdpug.org, phone number +1 480-951-1963 admin created HDP User Group Announces MacDermid Enthone Electronics Solutions as its Newest Member

    [Public] admin created HDP User Group Announces MacDermid Enthone Electronics Solutions as its Newest Member

    March 20, 2017 - 10:46am
    admin created HDP User Group Announces MacDermid Enthone Electronics Solutions as its Newest Member

     

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    10:41am
    [Public] admin updated Member Meetings March 20, 2017 - 10:41am

    [Public] admin updated Member Meetings

    March 20, 2017 - 10:41am
    admin updated Member Meetings

     

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Tuesday, March 7

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    10:14am
    [Public] admin updated March 1-2, 2017 Annual Member Meeting March 7, 2017 - 10:14am

    [Public] admin updated March 1-2, 2017 Annual Member Meeting

    March 7, 2017 - 10:14am
    admin updated March 1-2, 2017 Annual Member Meeting

     

    Changes to Attachments
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    File: Day_1_Presentations_March_2017.pdf
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    File: Day_2_Presentations_March_2017.pdf
     
    File: New_Project_Idea_Presentations_March_2017.pdf
     
    File: New_Project_Idea_Presentations_March_2017.pdf
    Changes to Attachments
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    File: Day_1_Presentations_March_2017.pdf
      +
    File: Day_2_Presentations_March_2017.pdf
     
    File: New_Project_Idea_Presentations_March_2017.pdf
     
    File: New_Project_Idea_Presentations_March_2017.pdf
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