PTH Creep Fatigue Under Roughness Influence
In the previous project "PTH Lifetime Predictor for TC", the lifetime predictor derived is applicable only when the strain is greater than 3.0x10-4 . Below this level, the strain is mainly creep strain which does not obey the Manson-Coffin rule. This project serves to provide a better understanding of creep strain on PTH and the influence of Cu plating roughness, using FEM simulations and verifying through high temperature testing. Once the creep characteristics of a typical PWB copper plating are identified, the creep consideration can be added into the AF equation of the PTH lifetime predictor.
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Members - Go to the "Subscribe Here" section to the right and select the "Subscribe to space" key.
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The PTH lifetime predictor for TC derived from the previous project is applicable if the strain experienced by the PTH is less than 3.0x10-4. PWB takes a long time to fail when the strain is low. Low strain, comprising mainly creep strain, would still cause PTH to crack. There is currently no establish equation to predict PTH lifetime at high temperation (HT).