HDP Best Technical Paper Award
HDP User Group Project Team Wins Best Technical Paper award at IPC APEX EXPO
Cave Creek, Arizona February 19, 2015. The High Density Packaging (HDP) User Group headquartered in the United States announces that its High Frequency Test Project Team has won best technical paper at IPC APEX EXPO.
This prestigious honor is given to one paper each year, selected from all of the papers presented at the symposium. Voted on through a ballot process by members of IPC's Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, February 24.
Taking top honors, the winning paper is, "High Frequency Loss Test Methods for Laminate Materials Comparison (a High Density Packaging User Group/HDPUG Project)," by Karl Sauter, Oracle Corporation USA. His co-author was Joseph Smetana, Alcatel-Lucent. The paper will be presented during technical conference session 11 on Wednesday, February 26.
The High Frequency Test project run by HDP User Group centered on evaluating several methods for testing high frequency PWB materials for various properties which are key to high speed circuit design. Today there are many ways to test and no relative comparison of the methods. Furthermore, there is no definition of moisture for any of the existing tests and moisture can significantly impact the test results. In this project OEMs and Material Suppliers worked closely in characterizing these methods as well as the impact of moisture
Marshall Andrews Executive Director of HDP User Group said, “We are pleased with excellent results of this project as well as the greater understanding of these critical measurement techniques it has provided our members. Congratulations to the paper authors and all of the team members for a job well done.”
About HDP User Group
HDP User Group (www.hdpug.org ) is a global research and development organization based in Cave Creek Arizona, is dedicated to “reducing the costs and risks for the Electronics Manufacturing industry when using advanced electronic packaging and assembly”. This international industry led group organizes and conducts R&D programs to address the technical issues facing the industry, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance. HDP User Group maintains additional offices in Austin, Texas; and Stockholm, Sweden.