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      • BFR/PVC Cables & Wires
      • Board Mount Power Supply (BMPS) Guideline II
      • Board Mounted Power Supplies (BMPS) Guideline I
      • Component Terminal Finishes Phase 2
      • Definition of Lead/Halide-free Products
      • Environmental Assessment of Halogen-free Printed Circuit Boards (DFE 2)
      • Evaluation of Environmentally-Sensitive Material Content in IT Products (DfE 1)
      • Evaluation of the Solderability of an Alternate Alloy
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      • Advanced QFN Evaluation
      • Alternative Alloy Study for Hole Fill and Copper Dissolution
      • Anti Counterfeit of Electronics Phase 3
      • Anti Counterfeit Phase 2
      • Anti-Counterfeit Electronics
      • Better CAF Acceleration Equation
      • BFR/PVC Free Cables 2
      • Board Mounted Power Supply evaluation
      • Board Thickness Effect on ATC Reliability
      • CAF TV for Material Characterization
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      • Component Terminal Finishes Phase 3
      • Counterfeit PCB Materials
      • Design Related PWB Material Damage
      • Digital Image Speckle Correlation 2
      • Digital Speckle Correlation (DSC)
      • Electro-Chemical Migration
      • Electro-Chemical Migration 2
      • FCBGA Package Warpage
      • FCBGA Package Warpage 2
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      • Harsh Use Environment Alloy Evaluation
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      • High Frequency Flex
      • High Frequency Laminate Measurements
      • High Frequency Loss from Copper Topology
      • High Frequency Measurements Phase 2
      • Lead Free Assembly Guideline - Version 3.0
      • Lead Free Board Materials Reliability 3
      • Lead Free Process Guideline version 3.0
      • Lead Free PWB Materials Reliability Phase 4
      • Lead Free PWB Materials Reliability Phase 5
      • Low Ag Alloy Solder Paste Reliability
      • Low/No Silver Alloy Solder Paste Phase 1 Process Characterization
      • Mechanical Fatigue Phase II - A
      • Mini Power Cycles
      • Multiple Alloy Screening
      • Nano-Coated Stencils
      • Optical FPC Assembly
      • Optoelectronics
      • Optoelectronics II
      • Pad Cratering
      • Predict Lead Free Solder Joint Life from Microstructure Evolution
      • Press-Fit Technology Rework
      • Process Sensitive Components
      • PTH Creep Fatigue Under Roughness Influence
      • PTH Lifetime Predictor for TC
      • PWB Back Drilling Failure Analysis
      • PWB Back Drilling Phase 2
      • PWB Environmental Life Cycle Analysis
      • PWB Environmental Life Cycle Analysis 2
      • RF Failure Detection
      • SAC Aging 2
      • SAC Aging 3
      • SAC Aging 3 84
      • SAC Aging Factors - A
      • Smooth Copper Signal Integrity
      • Solder Joint Reliability with Surface Finishes
      • Thin Cu Stress Test
      • TSV Board Level Reliability
      • TSV Signal Integrity
      • Ultra-Thin HDI Multi-Purpose Test Vehicle
      • VeCS Technology Evaluation
      • Wafer Level Packaging Materials
      • X-Ray Tomography Signal Integrity
  • Low Ag Alloy Solder Paste Reliability
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