Lead Free Process Guideline version 3.0
The General Purpose Lead Free (GPLF) assembly system guideline was originally developed in 2004 with a minor revision added in 2005. The aim of the document was to produce a handbook that would assist system integrators/ electronics producers and their supply chain in developing Pb-Free manufacturing solutions that meet required levels of reliability while complying with forthcoming environmental legislation. This is the next revision in that series.
It is proposed to form a new Lead Free Guideline team with the objectives of generating a 3rd edition of the guideline. The guideline will identify/ review current Pb- Free related preferred practises. In addition, recommendations generated from recent HDPUG projects and any relevant publicly released research data from within the industry will be considered. Lessons learnt from volume manufacturing since the introduction of RoHS and other legislation over the last 2 – 3 years will also be included. The exact scope of the guideline needs to be agreed among the participating team members, although some emphasis should be placed on processes to support the manufacture of higher reliability product types that are not yet legally required to be Pb-Free. Possible other considerations may be requirements from Medical, Aerospace and Automotive applications.