High Frequency Loss from Copper Topology project meeting
Date: Thursday, Apr 6, 2017Time: 11:00 AM - 12:00 PM
This is the follow on project to the Smooth CU Si project.
The recently completed Smooth Cu Si project suggested a difference in the X versus Y axis topography of the drum side of the copper foil after some treatments could affect insertion loss. This project will delve into the question of how this copper directionality or topography can affect insertion loss and evaluate the level of this loss. The project team will evaluate foil directionality/topology, differences in test method response to this directionality/topology and measure the difference in high frequency signal loss to foil directionality and surface treatments prior to lamination.
The new High Frequency Loss from Cu Topology website has been generated and this will be the last email from the old Smooth Cu Si site. Sorry if you have received this twice as we change over to the new website.