Harsh Use QFN Reliability Assessment

Automotive and Defense must operate in harsh environments.  Reliability is key for these mission critical markets. Current QFN packages have solder fillet geometries make them limited in joint strength. New lead and plating technology and geometries may have a positive impact on this problem.

Project stage: 

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Idea Information

Background: 

Automotive and Defense must operate in harsh environments.  Reliability is key for these mission critical markets. Current QFN packages have solder fillet geometries make them limited in joint strength. New lead and plating technology and geometries may have a positive impact on this problem.

In order to quantify any reliability improvements for this market area we must test these devices at a harsher temperature cycling condition than is normally used for Computer and data products. The goal of this project is to characterize new lead plating and forming options and compare to existing technology for QFN packages.

Problem: 

QFN is a low cost component type and would be desireable to use for Automotive and Defense applicatons but reliablity assessments have proven them unreliable for these application environments. Also QFN devices are difficult to for AOI equipment to inspect because solder joint are many times under the component lead.

There are new plating materials and lead forming techniques that may improve reliability and enable AOI inspection. Data is needed to document these potential improvements.

Definition Information

Goals / Benefits: 

This project will provide reliability assesment of these improvements and enable use in Automotive and Defense applications.

High level objectives: 

Provide reliability test data for -40 to 125C thermal cycle testing.

Provide assessement of solder joints for AOI applcation.

 

Approach: 

We will utilize existing HDP QFN test board to evaluate the performance of these improvements.