Harsh Use QFN Reliability Assessment

Automotive and Defense must operate in harsh environments.  Reliability is key for these mission critical markets. Current QFN packages have solder fillet geometries make them limited in joint strength. New lead and plating technology and geometries may have a positive impact on this problem.

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Idea Information

Background: 

Automotive and Defense must operate in harsh environments.  Reliability is key for these mission critical markets. Current QFN packages have solder fillet geometries make them limited in joint strength. New lead and plating technology and geometries may have a positive impact on this problem.

In order to quantify any reliability improvements for this market area we must test these devices at a harsher temperature cycling condition than is normally used for Computer and data products. The goal of this project is to characterize new lead plating and forming options and compare to existing technology for QFN packages.

Definition Information