Harsh Use Environment Alloy Evaluation
This project proposes to evaluate lead free solders that may be suitable for harsher environmental and use conditions such as transportation, and defense applications.
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Several new Lead Free alloys have been developed that may have better properties that may enable them perform better in harsh use environment. Performance data needs to be generated so that capabilities can be validated.
This project proposes to evaluate lead free solders that may be suitable for harsher environmental and use conditions such as transportation and defense applications. Some application environments are much more severe than in-plant networking and fixed environments. Many products have more stringent use cases which mandate greater and more frequent temperature cycling.
· Selection of ATC test protocols appropriate for harsh environment.
· Define the Vibration and Drop Testing requirements.
· Selection of Alloys to be tested.
· Selection of test vehicles and components.
Proposed Project Deliverables:
Phase 1 (iNEMI Collaboration)
· Development of a non-homogenous alloy TV with varied solder joint geometries (TV2).
· ATC testing and data from TV 2
· Development of a vibration and mechanical shock test vehicle (TV3)
· Vibration and shock testing of that vehicle with data
The project will be split into Two phases. The first phase will be a collaboration with iNEMI using the existing “Common Alloy Test Vehicle” (Figure xx shows the Common Alloy Test Vehicle) to gather initial data on 14 alloys and 4 different temperature cycles. In the first phase we will will sharing resources and results in this phase and is soon to go to implementations.
Many of our members are interested in a variety of solder joint geometries and mixed alloy assembly. The second test vehicle (TV) will focus on these. We are under discussion with members on what this TV will look like and what existing vehicles might be used.
The project has also been discussing vibration testing. Military applications have specific product requirements around this, so to provide a generic TV for this will be difficult. Physical location of the part on the board may impact the stress place on the component. This makes it difficult to analyze results. We have outlined testing variables but careful and complex planning will be required to make this an effective test.