General Purpose Lead Free (GPLF) I
This implementation guideline has considered industry-wide Pb-free development efforts and focused on presenting a common, compatible lead-free solder system that would facilitate the introduction of Pb-free products by system integrators and EMS providers.
It took more than 50 years to develop the tin-lead assembly system currently used in the electronics industry. During this period of time we continuously improved the process and built in reliability in the process. Current legislative and market circumstances are driving the industry to make the transition to lead-free in a short time-frame.
Waiting for the normal process evolution for this alignment will be slow and will not be very efficient. It requires an industry-wide well-coordinated effort, such as “General Purpose Lead-free Assembly System” (GPLF Assembly System) to make this happen in a cost-efficient and timely way.
As a result of several independent industry technology development activities, multiple solder systems have been proposed and are in use in the industry. Many system integrators have developed company specific requirements. Consequently, the Supply chain is faced with a situation where they have to qualify their products to different and often conflicting end user specifications.
By sharing the knowledge and technology risks of system integrators, the risk, cost and time to market for making the transition to lead-free electronics should be reduced significantly.