Environmental Assessment of Halogen-free Printed Circuit Boards (DFE 2)

The HDP User Group Design for Environment (DfE) group was formed in 2002 and was represented by companies such as Dell, Ericsson, HP, IBM, Intel and Nokia. The HDP User Group released two publicly-available reports regarding key environmental attributes of electronic products. Both reports were also presented at the 2003 and 2004 IEEE International Symposium on Electronics & the Environment.

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Idea Information

Background: 

The HDP User Group Design for Environment (DfE) group was formed in 2002 and was represented by companies such as Dell, Ericsson, HP, IBM, Intel and Nokia. The HDP User Group released two publicly-available reports regarding key environmental attributes of electronic products. Both reports were also presented at the 2003 and 2004 IEEE International Symposium on Electronics & the Environment.

Definition Information

Approach: 

There were three key objectives of the DfE Phase II project:

  • Assess environmental impacts of halogen-free flame retardant materials used in printed circuit boards and integrated circuit components.
  • Compare the environmental impacts of halogen-free materials to a baseline of TBBPA, the most widely used flame retardant in printed circuit boards and components.
  • Develop environmental data that member companies may use to assess their conversion to halogen-free materials.

Note: The technical performance of the materials (flammability, manufacturability, cost, etc) was not studied in this project but is part of the HDP User Group Halogen-free. This purpose of this report is to support the overall HDP User Group halogen-free work.

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