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Anti-Counterfeit Electronics

Idea/Definition Information
Summary: 

This project will address the issue of counterfeit electronics by defining a method that will allow tracability directly tied to the Build of Materials (BOM) of microelectronic components.

Background: 

Counterfeit components and ingredients can and do penetrate the supply chains of all manufacturing industries, including High Density Packaging.  Reports of counterfeit items penetrating military, aerospace, pharmaceutical, and electronic markets are receiving more attention in the press which is raising public concern and government regulatory agencies are investigating the issues.  Standards such as SAE AS5553, SEMI T20, and ANSI-NASPO-SA-2008 are emerging to help industry address some but not all of the counterfeiting issues and concerns.  One specific important issue and concern where a standard would bring value is defining a method to combine Trace and Trace data as defined in SEMI T20 with Build of Materials (BOM) data into an “As Built” data record that would enable a meaningful Supply Chain authentication to occur.  This is important to users when several ICs from different sources are combined into a single package unit.
 

Problem: 

Present Standards do not adequately address tracability needs for manufactured components.

Documentation:

Best Practices In The Fight Against Global Counterfeiting_ANSI: 581 KB Adobe Doc.
National Defense Authorization Act, 2012: 4,828 KB Adobe Doc. 
Counterfeit Components-Assesment Methodology and Metric Dev_iNEMI: 353 KB PowerPoint Doc.
SEMI T-20-0710 (Overview): Word Doc. 19 KB
Defense Industrial Base Assessment: Counterfeit Electronics_U.S. Department of Commerse: Adobe Doc. 860 KB
Counterfeit Electronics And The China Connection: Adobe Doc. 514 KB
    
Presentations:

Anti-Counterfeit Program, Sept 21st, 2011, Colm Nolan, IBM Misbranded Program Manager: PowerPoint 1,591 KB
Counterfeiting Electronics_Dave Brown_Intel: Adobe PDF 1,820 KB
Identity Management Standards for product lifecycle of electronic Parts_Yaw Obeng_NIST: PowerPoint 3,374 KB
Toward Authentication in the Electronics Supply Chain_Yaw Obeng_NIST: Adobe PDF 2076 KB
Counterfeit and Authenticity Verification_David Loany_Premier Semiconductor: Adobe PDF 2588KB
Proactive Anti-counterfeiting Efforts 2011_Yaw Obeng_NIST: Adobe PDF 3,611 KB
NASPO Standards Actions Update_Dave Brown_INTEL: PowerPoint 1,780 KB
Counterfeit Project Proposals_Colm Nolan_February 2012: PowerPoint 816KB 
YottaMark Presentation: Adobe Doc. 2 MB
 

Anti-counterfeiting Call Minutes:
   Latest Call Minutes:
   051012 Call Minutes

Previous Call Minutes 
    042612 Call Minutes
    041212 Call Minutes
    032612 Call Minutes
    030312 Call Minutes
    020912 Call Minutes
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    121511 Call Minutes
    112911 Call Minutes

 



 

Approach: 

A method will be crteated that will be tied to the Build of Materials (BOM), allowing tracability back to the beginning of the manufacturing cycle.