Alternative Alloy Study for Hole Fill and Copper Dissolution

Idea/Definition Information

Actual Project Stage:

Idea and Definition

Project Category:

Lead-Free

Project Leader Company:

Nihon Superior

Background:

•Erosion of lands and traces due to copper dissolution is one of the key issues in lead-free assembly.

•Copper dissolution tends to occur especially in wave soldering and reworking of through-hole joints.

•Many of the alternative alloys that provide low Cu dissolution may require longer dwell times to achieve hole-fill.

Problem:

There are not identified process parameters for hole-fill with alternative alloys for thick boards.

The difference in Cu erosion in both wave solder process and rework process has not been experimentally identified.

Approach:

A designed experiment to Identify process parameters to

achieve hole-fill with alternative alloys for thick boards.

• Measure Cu erosion in both the

wave solder process and rework

process.

• Determine Cu erosion rate for each

process.

HDP User Group Project Facilitator:

Jack Fisher

Key Participants:

Alcatel-Lucent, Celestica, Cisco, Dell, Flextronics, IBM, Tekelec, Philips, Nihon Superior

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