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Alternative Alloy Study for Hole Fill and Copper Dissolution

Idea/Definition Information
Summary: 

Investigate the damage to PWB wiring patterns caused by copper erosion in lead-free assembly. Copper erosion can occur during dipping, wave soldering and rework processes.

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Background: 

 

•Erosion of lands and traces due to copper dissolution is one of the key issues in lead-free assembly.
•Copper dissolution tends to occur especially in wave soldering and reworking of through-hole joints.
•Many of the alternative alloys that provide low Cu dissolution may require longer dwell times to achieve hole-fill.
Problem: 

 

 There are not identified process parameters for hole-fill with alternative alloys for thick boards.
 The difference in Cu erosion in both wave solder process and rework process has not been experimentally identified.
Approach: 

 

A designed experiment to Identify process parameters to
achieve hole-fill with alternative alloys for thick boards.
 
• Measure Cu erosion in both the
wave solder process and rework
process.
• Determine Cu erosion rate for each
process.