Board Mount Power Supply (BMPS) Guideline II

System integrators want to have well defined lead-free requirements on Board Mount Power Supplies (BMPS), Pin compatibility between functionally compliant BMPS, and industry standards for function compatibility of BMPS.  They also want to eliminate the need for modules to be attached using "press fit technology" or manual soldering.  Update and extend the information available in the BMPS Guideline.  Issue an updated version of the Guideline.

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Idea Information

Background: 

System integrators want to have well defined lead-free requirements on Board Mount Power Supplies (BMPS), Pin compatibility between functionally compliant BMPS, and industry standards for function compatibility of BMPS.  They also want to eliminate the need for modules to be attached using "press fit technology" or manual soldering.  Update and extend the information available in the BMPS Guideline.  Issue an updated version of the Guideline.

Problem: 

Systems Integrators and Power Module Suppliers need a common communication vehicle that will define options for pin and function compatibility, reliable interconnection techniques, and "best practices" for design, manufacturing, and assembly of BMPS.

Definition Information

Approach: 

The project team will prepare and edit a "BMPS Guideline" document, based on the HDP User Group "General Purpose Lead Free (GPLF) Guideline".  The Guideline is at the base technology level and the output will be provided to industry groups such as PSMA and EPSMA to encourage them to address needed industry standards.

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