Anti Counterfeit of Electronics Phase 3
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Counterfeit activities continue to expand and pose increased risk on all levels of the Supply Chain. From counterfeit military components to counterfeit medical devices and all levels between, counterfeits threaten all phases of life as we know it.
Phase 3 of the HDPug Anti-counterfeit of Electronics Project proposes to investigate future screening practices for evaluation of Anti-counterfeit technologies and protocols to use at various nodes of the Supply Chain.
In Phase 1 of the Anti-counterfeit of Electronics Project, the High Density Packaging User Group created a protocol for information to travel down (and up) the Supply Chain for authentication of components. In Phase 2, the team examined and contrasted the new and emerging technologies capable of moving this information along the Supply Chain.
Project Focus Areas:
· Anti-counterfeit of Electronics Phase 3 will be the most challenging of the phases as the team will need to enlist several nodes of the electronics Supply Chain to investigate future screening practices for evaluation of technologies and protocols for use at various nodes of the Supply Chain.
Benefits of Project:
· Participation in Anti-counterfeit of Electronics Phase 3 will give suppliers at each level of the Supply Chain the opportunity to test multiple approaches to the traceability issue and determine which technology works best for their products at each node in the Supply Chain.