Alternative Alloy Study for Hole Fill and Copper Dissolution

Investigate the damage to PWB wiring patterns caused by copper erosion in lead-free assembly. Copper erosion can occur during dipping, wave soldering and rework processes.

Project stage: 
Project type: 
Lead company: 
Nihon Superior

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Idea Information

Background: 

 

Erosion of lands and traces due to copper dissolution is one of the key issues in lead-free assembly.
Copper dissolution tends to occur especially in wave soldering and reworking of through-hole joints.
Many of the alternative alloys that provide low Cu dissolution may require longer dwell times to achieve hole-fill.
 
Problem: 

  There are not identified process parameters for hole-fill with alternative alloys for thick boards.

 The difference in Cu erosion in both wave solder process and rework process has not been experimentally identified.

Definition Information

Approach: 

A designed experiment to Identify process parameters to achieve hole-fill with alternative alloys for thick boards.

 • Measure Cu erosion in both the wave solder process and rework process.
• Determine Cu erosion rate for each process.
Key Participants: 
Celestica
Ciena
Dell
Flex
Fujitsu
Hitachi Chemical
Huawei
IBM
Isola Group
ITEQ
Nihon Superior
Park Electrochemical
Plexus
Senju Comtek
Shengyi
TTM Technologies
Public