"Technology Development in Today's Global Environment"

Completed Projects

Pad Cratering project just completed - Spherical Bend Test Device.

Meetings

Attendees at HDP User Group's annual Fall member meeting September 2016 hosted by Kyzen.

Projects

Assembled Mini-Power Cycle Test Vehicle.

Industry Out-Reach

Industry wide webinar on latest findings for tin whiskers in electronics held by HDP User Group and co-sponsored by EIPC, IPC, SMTA, and SEMI.

HDP Announces a New Project Electro-Chemical Migration 2

This is the next phase of the very successful ECM – 1 project which demonstrated the ability of the test vehicle to identify Pitting/Crevice type corrosion in the presence of no-clean flux residues.  The aim of this portion of the project is to improve the design of the current Test Vehicle and subsequently verify the existence of Pitting/Crevice type corrosion using multiple suppliers’ fluxes and multiple types of fluxes.

Read More.


Members

In order to access the member only portion of the web site you must be registered. If your company is a member of HDP User group, please go the registration link for instructions.

As a registered member you will have access to all projects that are in implementation phase as well as data and reports from past projects.

If your company is not a member and you would like to learn more about our project portfolio and the benefits of membership. Please contact our Marketing Director, Larry Marcanti.

Projects

HDP is a project oriented consortium dedicated to improving cooperation of all levels of the electronic packaging supply chain including system integrators, contract assembly manufacturers, and suppliers. Collaborative projects are run in a domain where members can gain much more by joint activities rather than duplicating work in each member company. Members share resources and are supplemented by a small project facilitation staff.

“The mission of HDP User Group International Inc. is to reduce the costs and risks for the electronics industries when employing the use of electronic packaging.”

 

Upcoming Events